Intel opens New Mexico Fab 9
- Fab 9 is part of Intel’s $3.5b investment to increase manufacturing capacity of advanced packaging technologies
- Foveros, an advanced packaging technology, will be a key enabler to help Intel meet the computing requirements of AI, edge, and 5G
- Maintain HOLD with TP US$45.30; Advanced packaging the new game changer beyond node scaling
Fab 9 is part of Intel’s $3.5b investment to increase manufacturing capacity of advanced packaging technologies, including intel’s 3D packaging technology known as Foveros. Foveros is a key enabler to help Intel meet the computing requirements of AI, edge, and 5G. Foveros involves vertical stacking of compute tiles and mixing and matching of compute tiles. This helps to provide greater performance while optimising for power and cost efficiency.
Advanced packaging the new game changer beyond node scaling. Moore’s law has slowed down given the higher costs and complexity of migrating to a new process node as it reaches molecular limits. As it becomes more challenging to double the number of transistors on an integrated circuit every two years, semiconductor firms are turning to advanced packaging to increase processing power. Intel believes that advanced packaging technology such as Foveros and EMIB (embedded multi-die interconnect bridge) would help extend Moore’s law beyond 2030. HOLD TP US$45.30.